Leading experts in 3D integration and systems for semiconductor manufacturing applications have gathered at the annual SEMI 3D & Systems Summit, 14-15 June, 2022, in Dresden for insights into the latest heterogenous integration innovations for semiconductor applications enabling the future of intelligent systems.
As key European innovation project, the IMOCO4.E consortium was a welcomed addition to the 3D and Systems Summit 2022 to share its achievements and views on the future of Industry 4.0 manufacturing. The dissemination of the project was conducted among highly influential audiences from every segment of the global microelectronics industry, including C-level executives, leading manufacturers, key technology stakeholders and purchasers. By focusing on the core objective of engaging businesses and professional as potential future beneficiaries of IMOCO4.E delivered innovation, the possibility to engage the consortium representatives and project in a direct way proved to be an excellent way to connect with potential stakeholders and collect insight on potential applications of IMOCO4.E achievements across industries.
More details here.
Official event pictures can be found here.